Technical Capabilities

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  • Materials and process per military and IPC spec. UL approved.
  • D/Sided & Multi-layers up to 14 layers. Mat’l thickness > .002 – .200″
  • Minimum line and spacing .005″. Min hole size .008″
  • Max active board size 16 x 22″. Max copper thickness 5 oz.
  • Mat’l: FR-4, FR-5, Polyamide, Teflon, Rogers, Taconic, Arlon…
  • SMOBC. LPI or Dry Film Sodlermask green, blue, red, black…
  • Silkscreen: white, black, yellow.
  • Soft & Hard gold, for tabs and SMT. Matte Tin plate; HASL.
  • PCB DESIGN/LAYOUT

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